目錄
Catalog 培訓(xùn)內(nèi)容/時(shí)間
Course Title 課程內(nèi)容
Content
失效分析
Failure analysis 常用失效分析流程和工具
Failure analysis and tools
1天
1day · 失效定義及分類 Definition and classification of failures
· 電子產(chǎn)品為何失效 Why do electronic products fail?
· 失效分析的目標(biāo) The objectives of failure analysis
· 失效分析的重要性 Understand the importance of failure analysis
· 失效分析的思想方法 Philosophical approach of failure analysis
· 失效分析技術(shù)線路 Technique approach of failure analysis
· 失效分析流程 Failure analysis flow charts
· 常用失效分析無損檢測(cè)工具 Nondestructive analysis tools for failure analysis
· 常用失效分析物理解剖和定位工具Destructive analysis tools and failure isolation tools
失效分析
Failure analysis 電子封裝失效分析
Electronic package and failure analysis
0.5天
0.5 day · 失效定義及分類 Definition and classification of failures
· 電子產(chǎn)品為何失效 Why do electronic products fail?
· 失效分析的目標(biāo) The objectives of failure analysis
· 失效分析的重要性 Understand the importance of failure analysis
· 失效分析的思想方法 Philosophical approach of failure analysis
· 失效分析技術(shù)線路 Technique approach of failure analysis
· 失效分析流程 Failure analysis flow charts
· 解決問題的8D方法 Eight disciplines (8D) in problem solving
· 元器件典型失效模式和機(jī)理 Typical failure modes and failure mechanisms of electronics components
· 典型封裝產(chǎn)品失效分析案例 Case study for electronic package failure analysis
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